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Ppawip's avatar

Great work! Look forward to the article on tool density for EML vs CPO

WritedownCap's avatar

Thanks for showing the InP tool build - been waiting for this. My main question is your yield improvement / number of InP chips required for EML vs CW, which is in the productivity improvement assumptions of MSD% each year I believe? I think tools demand is very sensitive to wafer size and whether it will be EML vs CW on the math I did, for example if assuming wafer size transition from 100 to 150 to 200mm can effectively decrease tool demand by 40-65% with each transition.

At this point, I think the opto revenues number for 2026 is pretty locked in but bigger question is can the tool demand in 2027-28 sustain strong growth rates if combination of wafer size transition + InP laser chip intensity changes. I think EML laser chip intensity is much higher than CW (which is the direction of travel as CPO uses CW)? Would welcome thoughts here.

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